Electronic manufacturing services
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Electronic manufacturing services

PCB Assembly & Electronics Contract Manufacturing

Since 2011, Right Electronics has specialized in medium-volume electronics manufacturing, providing SMT assembly, through-hole assembly, selective soldering, and quality inspection services

Manufacturing

Capabilities

A team of qualified specialists, high-precision equipment, extensive experience, and established supply chains allow us to handle a wide range of manufacturing requirements.

01

Complex Assemblies

High-layer-count PCBs (14, 16, 24+ layers), high-density assembly of miniature components (01005), complex BGA and QFN packages

02

Mass-Produced Assemblies

Cost optimization, detailed BOM analysis, consistent production volumes, and predictable lead times

03

Custom Assemblies

Products requiring specialized assembly conditions or unique components. Collaboration with design teams. Fabrication of assembly tooling and fixtures

Modern equipment

Technical capabilities

Maximum PCB size: 510×460 mm
Placement accuracy: ±0.025 mm
Quality standards: IPC-A-610 Class 2 and 3
Minimum component size: 01005 (0.4×0.2 mm)
Supported components: 01005 chip components, QFP, BGA, CSP and LGA packages
Placement speed: up to 125,000 CPH

SMT

Pick-and-place machines

Automated SMD lines based on Yamaha YSM10 and YSM20 systems. High-speed placers with a placement accuracy of ±25 µm. Support for components ranging from 01005 to large BGA and QFN packages.

THT

Selective soldering

Selective soldering equipment in a nitrogen atmosphere. Automated systems for spot soldering of THT components. Leaded and lead-free solders.

AOI

3D AOI inspection

3D Automated Optical Inspection for high-precision quality control of SMD component assembly and soldering.

X-Ray

X-ray inspection

X-ray inspection of components with bottom-terminated components, viewed directly and at angles up to 45°.

Assembly Capabilities

From simple modules
to complex multilayer assemblies

Production lines and technological processes enable the handling of products varying in complexity, assembly density, and intended application.

01 07
Complex multilayer electronic circuit board
Server electronic board
Compact telecommunications electronic module
Industrial I/O board
Wireless electronic module
Expansion board with BGA components
Power electronics board
Complex PCBA

High component density

Multilayer boards with high component density, BGA/QFN packages, interface connectors, and mixed component technologies.

BGA QFN Fine Pitch Multilayer PCB
Computing Systems

Server-grade boards

Large-format assemblies with a high density of BGA components, memory chips, and connectors, and a complex power delivery system.

BGA DDR Large PCB High Density
IoT / telemetry

Compact IoT modules

Assembly of microcontrollers, radio modules, SIM interfaces, SMD antennas, and compact passive peripheral components.

MCU RF SIM SMD
Industrial automation

Interface and I/O boards

Mixed SMD/THT assembly featuring a large number of leaded connectors, industrial interfaces, and discrete channels.

THT SMD I/O Industrial
Wireless devices

Miniature processor boards

Compact devices featuring integrated Wi-Fi/Bluetooth modules, power controllers, and a complement of small SMD components.

Wi-Fi Bluetooth MCU 0402 / 0201
Expansion cards

BGA, memory, and high-density routing

Processor and FPGA modules featuring large BGA packages, memory chips, and edge-card connectors.

FPGA BGA Memory Edge connector
Power electronics

Mixed assembly of power components

Power semiconductors, large-format leaded components, inductors, capacitors, and screw terminal connections.

Power THT MOSFET High Voltage
i

The images shown are illustrative visualizations demonstrating the nature and level of technological complexity of the products our manufacturing facilities can handle. These designs do not correspond to specific client projects; we maintain confidentiality and adhere to NDA requirements.

Quality

Transparency and accountability

The corporate service model entails clear terms, documentation support, and quality control.

ISO ISO 9001:2015 Certification
MES IT system for full product traceability within production
IPC-A-610 PCB assembly workmanship in accordance with IPC-A-610
NDA In-house digital infrastructure and strict security policies

Address

59 Kavkazsky Boulevard, Moscow, 115516

Telephone

+7 (495) 540-57-37

E-mail

info@rightelectronics.ru

Map

Please send the documentation (BOM, Gerber) for a quote

We will prepare a proposal covering costs, timelines, and possible delivery options

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